This series of tape products is developed for the needs of fixing the foot line of high-temperature electronic components. It is made of and paper coated with solvent-based pressure-sensitive adhesive after soaking, release and other treatment.
Product model |
Thickness |
Initial tack (ball test) |
Peel adhesion (steel board) |
Tensile strength |
Temperature resistance /UV resistance |
830 |
100±15μm |
≥8# |
≥2.5N/25mm |
≥30N/cm |
120℃*60min |
829 |
95±15μm |
≥8# |
≥2N/25mm |
≥30N/cm |
100℃*60min |
Please contact with our sales for more product models, detailed performance and specific applications.